DoD program managers can leverage reverse engineering (RE) to assist with acquisition and sustainment efforts of microelectronics products, with particular emphasis on circuit card assemblies (CCAs). The webinar will provide a brief overview of RE within the DoD and discuss how it can be used to help solve product documentation issues faced by DoD programs. 

Specific focus will be on the RE process used by DMEA to create technical data packages for CCAs, with reference to specific DoD examples. The webinar will also highlight best practices for programs to consider when conducting intellectual property (IP) due diligence prior to reverse engineering efforts and will address IP rights in technical data package deliverables.