DoD
program managers can leverage reverse engineering (RE) to assist with
acquisition and sustainment efforts of microelectronics products, with
particular emphasis on circuit card assemblies (CCAs). The webinar will provide
a brief overview of RE within the DoD and discuss how it can be used to help
solve product documentation issues faced by DoD programs.
Specific
focus will be on the RE process used by DMEA to create technical data packages for
CCAs, with reference to specific DoD examples. The webinar will also highlight
best practices for programs to consider when conducting intellectual property
(IP) due diligence prior to reverse engineering efforts and will address IP
rights in technical data package deliverables.