​Digital Microelectronics Engineering Digital Twinning 8.18.22

Description:

This third of the four-webinar series will review the trends towards Digital Twins' application throughout the whole product life cycle, from pre-silicon development for verification and software development, system integration before fabrication, and product bring-up to applications all the way to the end-of-life of a product. We will introduce practical examples for the industry verticals Consumer, Hyperscale Computing, Mobile, 5G Communications, Aerospace & Defense, Automotive, Industrial and Health. We will touch on critical challenges like reusing data between different phases of development, the impact of model fidelity on use-models, and the connection of models at varying accuracy levels to find the optimal balance between performance and development efforts.